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INTEGRATED CIRCUITS
DATA SHEET
TDA1572 AM receiver circuit
Product specification File under Integrated Circuits, IC01 December 1987
Philips Semiconductors
Product specification
AM receiver circuit
GENERAL DESCRIPTION
TDA1572
The TDA1572 integrated AM receiver circuit performs all the active functions and part of the filtering required of an AM radio receiver. It is intended for use in mains-fed home receivers and car radios. The circuit can be used for oscillator frequencies up to 50 MHz and can handle RF signals up to 500 mV. RF radiation and sensitivity to interference are minimized by an almost symmetrical design. The controlled-voltage oscillator provides signals with extremely low distortion and high spectral purity over the whole frequency range, even when tuning with variable capacitance diodes. If required, band switching diodes can easily be applied. Selectivity is obtained using a block filter before the IF amplifier. Features * Inputs protected against damage by static discharge * Gain-controlled RF stage * Double balanced mixer * Separately buffered, voltage-controlled and temperature-compensated oscillator, designed for simple coils * Gain-controlled IF stage with wide AGC range * Full-wave, balanced envelope detector * Internal generation of AGC voltage with possibility of second-order filtering * Buffered field strength indicator driver with short-circuit protection * AF preamplifier with possibilities for simple AF filtering * Electronic standby switch * IF output for stereo demodulator and search tuning. QUICK REFERENCE DATA PARAMETER Supply voltage range Supply current range RF input voltage for (S+N)/N = 6 dB at m = 30% RF input voltage for 3% total harmonic distortion (THD) at m = 80% IF output voltage with Vi = 2 mV AF output voltage with Vi = 2 mV; fi = 1 MHz; m = 30%; fm = 400 Hz AGC range: change of Vi for 1 dB change of Vo(AF) Field strength indicator voltage at Vi = 500 mV; RL(11) = 2,7 k PACKAGE OUTLINE 18-lead DIL; plastic (SOT102); SOT102-1; 1996 August 12. VIND - 2,8 - V - 86 - dB Vo(AF) - 310 - mV Vi(RF) Vo(IF) - - 500 230 - - mV mV Vi(RF) - 1,5 - V VP IP SYMBOL 15 MIN. 7,5 - - TYP. MAX. 18,0 30 V mA UNIT
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December 1987
Philips Semiconductors
AM receiver circuit
3 Product specification
(1) Coil data: TOKO sample no. 7XNS-A7523DY; L1 : N1/N2 = 12/32; Qo = 65; QB = 57. Filter data: ZF = 700 at R3-4 = 3 k; ZI = 4,8 k. (2) AF output is pin 6 is not used.
TDA1572
Fig.1 Block diagram and test circuit (connections shown in broken lines are not part of the test circuit).
Philips Semiconductors
Product specification
AM receiver circuit
FUNCTIONAL DESCRIPTION Gain-controlled RF stage and mixer
TDA1572
The differential amplifier in the RF stage employs an AGC negative feedback network to provide a wide dynamic range. Very good cross-modulation behaviour is achieved by AGC delays at the various signal stages. Large signals are handled with low distortion and the (S+N)/N ratio of small signals is improved. Low noise working is achieved in the differential amplifier by using transistors with low base resistance. A double balanced mixer provides the IF output signal to pin 1. Oscillator The differential amplifier oscillator is temperature compensated and is suitable for simple coil connection. The oscillator is voltage-controlled and has little distortion or spurious radiation. It is specially suitable for electronic tuning using variable capacitance diodes. Band switching diodes can easily be applied using the stabilized voltage V13-18. An extra buffered oscillator output (pin 12) is available for driving a synthesizer. If this is not needed, resistor RL(12) can be omitted. Gain-controlled IF amplifier This amplifier comprises two cascaded, variable-gain differential amplifier stages coupled by a band-pass filter. Both stages are gain-controlled by the AGC negative feedback network. The IF output is available at pin 10. Detector The full-wave, balanced envelope detector has very low distortion over a wide dynamic range. Residual IF carrier is blocked from the signal path by an internal low-pass filter. AF preamplifier This stage preamplifies the audio frequency output signal. The amplifier output has an emitter follower with a series resistor which, together with an external capacitor, yields the required low-pass for AF filtering. AGC amplifier The AGC amplifier provides a control voltage which is proportional to the carrier amplitude. Second-order filtering of the AGC voltage achieves signals with very little distortion, even at low audio frequencies. This method of filtering also gives fast AGC settling time which is advantageous for electronic search tuning. The AGC settling time can be further reduced by using capacitors of smaller value in the external filter (C16 and C17). The AGC voltage is fed to the RF and IF stages via suitable AGC delays. The capacitor at pin 7 can be omitted for low-cost applications. Field strength indicator output A buffered voltage source provides a high-level field strength output signal which has good linearity for logarithmic input signals over the whole dynamic range. If the field strength information is not needed, RL(11) can be omitted. Standby switch This switch is primarily intended for AM/FM band switching. During standby mode the oscillator, mixer and AF preamplifier are switched off. Short-circuit protection All pins have short-circuit protection to ground.
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Philips Semiconductors
Product specification
AM receiver circuit
RATINGS Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) PARAMETER Supply voltage Total power dissipation Input voltage Ptot V16-17 -V16-18, -V17-18 V16-18, V17-18 Input current Operating ambient temperature range Storage temperature range Junction temperature THERMAL RESISTANCE From junction to ambient Rth j-a 80 I16, I18 Tamb Tstg Tj SYMBOL VP = V15-18 - - - - - - -40 -55 - MIN. 20 875 12 0,6 VP 200 + 85 + 150 + 125 MAX.
TDA1572
UNIT V mW V V V mA C C C
K/W
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
CHARACTERISTICS VP = V15-18 = 8,5 V; Tamb = 25 C; fi = 1 MHz; fm = 400 Hz; m = 30%; fIF = 460 kHz; measured in test circuit of Fig.1; all voltages referenced to ground; unless otherwise specified. PARAMETER Supply Supply voltage (pin 15) Supply current (pin 15) RF stage and mixer (pins 16 and 17) DC input voltage RF input impedance at V < 300 V RF input capacitance RF input impedance at VI > 10 mV RF input capacitance IF output impedance (pin 1) IF output capacitance Conversion transconductance before start of AGC Maximum IF output voltage, inductive coupling to pin 1 (peak-to-peak value) DC value of output current; at VI = 0 V (pin 1) AGC range of input stage RF signal handling capability: (r.m.s. value): input voltage for THD = 3% at m = 80% Oscillator Frequency range Oscillator amplitude (pins 13 to 14) External load impedance (pins 14 to 13) External load impedance for no oscillation (pins 14 to 13) Ripple rejection at VP(rms) = 100 mV; fp = 100 Hz (SVRR = 20 log [V15/V13]) Source voltage for switching diodes (6 x VBE) (pin 13) DC output current (for switching diodes) (pin 13) Change of output voltage at l13 = 20 mA (switch to maximum load) (pin 13) VI 6 - 0,3 - V -IO 0 - 20 mA V - 4,2 - V RR - 55 - dB R(ext) - - 60 fosc V R(ext) 0,1 - 0,5 - 130 - 60 150 200 MHz mV k Vi(rms) - 500 - mV IO - - 1,2 30 - - mA dB V1-15(p-p) - 5 - V I1/Vi - 6,5 - mA/V VI Zi Ci Zi Ci Zo Co - - - - - 200 - VP/2 5,5 25 8 22 - 6 - - - - - - - V k pF k pF k pF VP IP 7,5 15 8,5 23 18,0 30 V mA SYMBOL MIN. TYP. MAX. UNIT
December 1987
Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
PARAMETER Buffered oscillator output (pin 12) DC output voltage Output signal amplitude (peak-to-peak value) Output impedance Output current IF, AGC and AF stages DC input voltage (pins 3 and 4) IF input impedance (pins 3 to 4) IF input capacitance IF input voltage for THD = 3% at m = 80% (pins 3 and 4) IF output impedance (pin 10) Unloaded IF output voltage at Vi = 10 mV (pin 10) Voltage gain before start of AGC (pins 3 to 4; 6 to 18) AGC range of IF stages: change of V3-4 for 1 dB change of Vo(AF); V3-4 (ref) = 75 mV AF output voltage at V3-4(IF) = 50 V AF output voltage at V3-4(IF) = 1 mV AF output impedance (pin 6) Indicator driver (pin 11) Output voltage at Vi = 0 mV; RL = 2,7 k Output voltage at Vi = 500 mV; RL = 2,7 k Load resistance Standby switch Switching threshold at; VP = 7,5 to 18 V Tamb = -40 to +80 C ON-voltage OFF-voltage ON-current at V2-1 = 0 V OFF-current at V2-1 = 20 V Vo RL Vo Gv Vo Vi Zo VI Zi Ci VO
SYMBOL - - - - -
MIN.
TYP. - - - 3 -
MAX.
UNIT
0,8 320 170 -
V mV mA
Vo(p-p) ZO -IO(peak)
2,0 3,0 7 90 50 230 68
V k pF mV mV dB
2,4 - - - 180 -
3,9 - - - 290 -
Vv Vo(AF) Vo(AF) Zo
- - - 2,8
55 130 310 3,5
- - - 4,2
dB mV mV k
- 2,5 1,5
- 2,8 -
140 3,1 -
mV V k
V2-1 V2-1 -I2 I2
0 3,5 - -
- - 100 -
2,0 20,0 200 10
V V A A
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
OPERATING CHARACTERISTICS VP = 8,5 V; fi = 1 MHz; m = 30%; fm = 400 Hz; Tamb = 25 C; measured in Fig.1; unless otherwise specified PARAMETER RF sensitivity RF input required for (S+N)/N = 6 dB RF input required for (S+N)/N = 26 dB RF input required for (S+N)/N = 46 dB RF input at start of AGC RF large signal handling RF input at THD = 3%; m = 80% RF input at THD = 3%; m = 30% RF input at THD = 10%; m = 30% AGC range Change of Vi for 1 dB change of Vo(AF); Vi(ref) = 500 mV Change of Vi for 6 dB change of Vo(AF); Vi(ref) = 500 mV Output signal IF output voltage at Vi = 2 mV AF output voltage at Vi = 4 V; m = 80% AF output voltage at Vi = 2 mV THD at Vi = 1 mV THD at Vi = 500 mV Signal plus noise-to-noise ratio at Vi = 100 mV Ripple rejection at Vi = 2 mV; VP(rms) = 100 mV; fp = 100 Hz (SVRR = 20 log [VP/Vo(AF)]) a) additional AF signal at IF output b) add modulation at IF output (mref = 30%) RR - 40 - dB RR RR - - 38 0* - - dB dB (S+N)/N - 58 - dB Vo(AF) Vo(AF) dtot dtot - 240 - - 130 310 0,5 1 - 390 - - mV mV % % Vo(IF) 180 230 290 mV Vi - 91 - dB Vi - 86 - dB Vi Vi Vi - - - 500 700 900 - - - mV mV mV Vi Vi Vi Vi - - - - 1,5 15 150 30 - - - - V V V V SYMBOL MIN. TYP. MAX. UNIT
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
PARAMETER Unwanted signals Suppression of IF whistles at Vi = 15 V; m = 0% related to AF signal of m = 30% at fi 2 x fIF at fi 3 x fIF IF suppression at RF input; for symmetrical input for asymmetrical input Residual oscillator signal at mixer output; at fosc at 2 x fosc IF IF
SYMBOL
MIN.
TYP.
MAX.
UNIT
2IF 3IF
- - - - - -
** ** 40 40 1 1,1
- - - - - -
dB dB dB dB A A
I1(osc) I1(2osc)
* AF signals at the IF output will be suppressed by a coupling capacitor to the demodulator and by full wave-detection in the demodulator. ** Value to be fixed. APPLICATION INFORMATION
(1) Capacitor values depend on crystal type. (2) Coil data: 9 windings of 0,1 mm dia laminated Cu wire on TOKO coil set 7K 199CN; Qo = 80.
Fig.2 Oscillator circuit using quartz crystal; centre frequency = 27 MHz.
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
Fig.4 Fig.3 AF output as a function of RF input in the circuit of Fig.1; fi = 1 MHz; fm = 400 Hz; m = 30%.
Total harmonic distortion and (S + N)/N as functions of RF input in the circuit of Fig.1; m = 30% for (S + N)/N curve and m = 80% for THD curve.
Fig.5
Total harmonic distortion as a function of modulation frequency at Vi = 5 mV; m = 80%; measured in the circuit of Fig.1 with C7-18(ext) = 0 F and 2,2 F.
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
Fig.7
Fig.6
Indicator driver voltage as a function of RF input in the circuit of Fig.1.
Typical frequency response curves from Fig.1 showing the effect of filtering as follows: with IF filter; -- with AF filter; ------ with IF and AF filters.
Fig.8 Car radio application with inductive tuning.
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
Fig.9 AF output as a function of RF input using the circuit of Fig.8 with that of Fig.1.
Fig.10 Suppression of cross-modulation as a function of input signal, measured in the circuit of Fig.8 with the input circuit as shown in Fig.11. Curve is for Wanted Vo(AF)/Unwanted Vo(AF) = 20 dB; Vrfw,Vrfu are signals at the aerial input, V'aew, V'aeu are signals at the unloaded output of the aerial. Wanted signal (V'aew, Vrfw): fi = 1 MHz; fm = 400 Hz; m = 30%. Unwanted signal (V'aeu, V'rfu): fi = 900 kHz; fm = 400 Hz; m = 30%. Effective selectivity of input tuned circuit = 21 dB.
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
Fig.11 Input circuit to show cross-modulation suppression (see Fig.10).
Fig.12 Oscillator amplitude as a function of pin 13, 14 impedance in the circuit of Fig.8.
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
Fig.13 Total harmonic distortion and (S + N)/N as functions of RF input using the circuit of Fig.8 with that of Fig.1.
Fig.14 Forward transfer impedance as a function of intermediate frequency for filters 1 to 4 shown in Fig.15; centre frequency = 455 kHz.
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
Fig.15 IF filter variants applied to the circuit of Fig.1. For filter data, refer to Table 1.
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Philips Semiconductors
Product specification
AM receiver circuit
TDA1572
Fig.16 IF output voltage as a function of RF input in the circuit of Fig.1; fi = 1 MHz.
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Table 1 2 L1 430 13 : (33 + 66) 15 : 31 0,09 75
66 13 33 15 29 31 13 31 29
Data for IF filters shown in Fig.15. Criteria for adjustment is ZF = maximum (optimum selectivity curve at centre frequency f0 = 455 kHz). See also Fig.14. 3 L1 3900 29 : 29 0,08 60 75 0,09 mm 13 : 31 4700 3900 pF L2 L1 4 UNIT
FILTER NO.
1
December 1987
Coil data
L1
Value of C
3900
Philips Semiconductors
N1: N2 0,08 50
12 : 32
Diameter of Cu
AM receiver circuit
laminated wire
0,09
Qo
65 (typ.)
Schematic* of windings
12
32
(N1) L7PES-A0060BTG 7XNS-A7518DY 7XNS-A7521AIH
(N2) 7XNS-A7519DY
Toko order no.
7XNS-A7523DY
Resonators SFZ455A 4 3 4,2 24 24 4,2 3 4 SFZ455A SFT455B 6 3 4,5 38 dB k kHz dB
17 3,8 40 0,67 3,8 31 49 58 52 (L1) 0,68 3,6 36 54 66 4,2 18 (L2)
Murata type
SFZ455A
D (typical value)
4
RG, RL
3
Bandwidth (-3 dB)
4,2
S9kHz
24
Filter data 4,8 55 0,68 4,0 42 64 74 k kHz dB dB dB k
ZI
4,8
QB
57
ZF
0,70
Bandwidth (-3 dB)
3,6
S9kHz
35
S18kHz
52
S27kHz
63
Product specification
TDA1572
* The beginning of an arrow indicates the beginning of a winding; N1 is always the inner winding, N2 the outer winding.
Philips Semiconductors
Product specification
AM receiver circuit
PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil)
TDA1572
SOT102-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 18 10 b2 MH wM (e 1)
pin 1 index E
1
9
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-10-14 95-01-23
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Philips Semiconductors
Product specification
AM receiver circuit
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1572
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
December 1987
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